High customer value: Lower LCOE, reduced BOS cost, better ROI. Lowest guaranteed first year and annual degradation. Optimized compatibility with existing mainstream system components. High power up to 620W: Up to 23.0% module efficiency. High density interconnection provides improved power density. High reliability: Minimized micro-cracks with innovative non-destructive cutting technology. Ensured PID resistance. Resistant to harsh environments. Mechanical performance up to +5400/-2400 Pa. High energy yield: Excellent IAM and low irradiation performance. Lower temperature coefficient (-0.29%/C) and operating temperature. Up to 30% additional power gain from back side.