SMBB Technology
Better light trapping and current collection to improve
module power output and reliability. PID Resistance
Excellent Anti-PID performance guarantee via
optimized mass-production process and materials
control. Higher Power Output
Module power increases 5-25% generally, bringing
significantly lower LCOE and higher IRR. Hot 2.0 Technology
The N-type module with Hot 2.0 technology has better
reliability and lower LID/LETID. Enhanced Mechanical Load Certified to withstand: wind load (2400 Pascal) and snow
load (5400 Pascal).