TCL TCL-MI615-DT210RP-66NS 590-615 1500V Silver Frame

HIGH ENERGY YIELD • High-density cell package, increasing 2% cells • Lower temperature coefficient (Pmax): -0.29%/°C • Up to 80% power bifaciality INDUSTRY-LEADING G12R WAFER • <1% degradation in the first year • Smaller wafer chamfer, larger light receiving area • Wafer:210R,Thickness:<130um SUPERIOR CUSTOMER VALUE • Integrated technology: TOPCon + Shingling • Optimized dimension design for all scenarios • More artistic beauty with no-gap design LONG-TERM RELIABILITY • 1/3 cell technology, lower current loss and hot spot risk . • Harsh environment resistance • Damage-free laser cutting, lower micro-crack risk • Mechanical load: Front 5400 Pa, Back 2400 Pa